Dynamic Multi-Criteria Bottleneck Severity Index (DMBSI) for Semiconductor Wafer Manufacturing: A Genetically Optimised Framework for Reentrant Production Systems

תקציר מקורי באנגליתarXiv:2607.24819v1 Announce Type: cross Abstract: Wafer fabrication exhibits unique characteristics, including reentrant process flows, variable bottlenecks, and highly variable process conditions. In order to identify the most severe bottleneck at each moment in time for semiconductor wafer fabrication, this research presents the Dynamic Multi-Criteria Bottleneck Severity Index (DMBSI), a new, data-driven methodology for analysing multiple diagnostic signals of cycle time to changes in process parameters, and the impact of reworks on cycle time in order to generate an interpretable, unified measure of bottleneck severity. The experimental validation of DMBSI was conducted using Manufacturing Execution System (MES) logs collected from 22 wafer production lots at a commercial 200 mm wafer f