מפתח תרמי תלת־ממדי עם תכונות AI

תקציר מקורי באנגליתarXiv:2610.02461v1 Announce Type: new Abstract: Accurate thermal analysis of heterogeneous 2.5D/3D-IC packages is essential yet computationally prohibitive. A single full-package FEM simulation can take hours, while AI-based surrogates treat the entire stack as a monolithic prediction target and must be retrained whenever the die count or topology changes. To address this limitation, this work proposes Domain-Decomposed AI-Accelerated Iterative Solver for Thermal Analysis (DAIST), a composable thermal solver that decomposes the global package simulation into block-level subdomain problems, replaces subdomain solvers with neural operators, and couples them through iterative exchanges of interfacial temperature and heat flux. This local-to-global architecture eliminates the topology lock-in